The Ministry of Electronics and Information Technology (MeitY) has officially announced the continued implementation of the Design Linked Incentive (DLI) Scheme under the Semicon India Programme to strengthen India’s semiconductor design ecosystem. The scheme provides financial incentives and EDA tool access to startups, MSMEs, and domestic companies for semiconductor design and deployment. Eligible entities can apply through the dedicated DLI portal for product design reimbursement and deployment-linked incentives.

The scheme has already supported 24 projects, facilitated 16 chip tape-outs, and engaged over 1,000 specialized engineers. Interested firms must meet eligibility criteria and apply as per guidelines on the official portal.
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Design Linked Incentive Scheme 2026: Overview
The Design Linked Incentive (DLI) Scheme aims to catalyze India’s semiconductor design capabilities by supporting fabless chip design companies. Below is a detailed overview with key highlights.
| Scheme Name | Design Linked Incentive (DLI) Scheme |
|---|---|
| Launch Date | December 2021 |
| Implementing Ministry | Ministry of Electronics and IT (MeitY) |
| Parent Programme | Semicon India Programme (₹76,000 Cr outlay) |
| Nodal Agency | C-DAC |
| Application Mode | Online via DLI Portal |
| Incentive Type | Financial reimbursement + Deployment-linked support |
| Eligible Entities | Startups, MSMEs, Domestic Companies |
| Key Achievements | 24 projects, 16 tape-outs, 6 ASICs, 10 patents, 1,000+ engineers |
DLI Scheme Vacancy / Support Areas
The DLI Scheme supports semiconductor design across multiple strategic domains:
| S.No. | Focus Area |
|---|---|
| 1 | Video Surveillance SoCs |
| 2 | Drone Detection Systems |
| 3 | Energy Metering Chips |
| 4 | Microprocessors |
| 5 | Satellite Communication ICs |
| 6 | IoT & Broadband SoCs |
Design Linked Incentive Scheme Eligibility 2026
Entities must fulfill the following criteria:
Eligible Organizations:
- Startups (as per DPIIT definition)
- MSMEs (as per MSME Ministry norms)
- Domestic Companies (owned by resident Indian citizens)
Design Focus Areas:
- Integrated Circuits (ICs), Chipsets, Systems on Chip (SoC), Semiconductor-linked designs, IP Cores.
Financial Eligibility:
- For Product Design: Up to 50% reimbursement of eligible expenses, capped at ₹15 Cr.
- For Deployment: 6–4% of net sales turnover for 5 years, capped at ₹30 Cr.
Design Linked Incentive Scheme Incentive Structure 2026
| Incentive Type | Support Provided | Cap |
|---|---|---|
| Product Design Linked Incentive | 50% reimbursement of eligible design expenditure | ₹15 crore |
| Deployment Linked Incentive | 6% (Year 1–2) to 4% (Year 3–5) of net sales turnover | ₹30 crore |
| Design Infrastructure Support | Access to EDA tools, IP cores, MPW prototyping, validation | Via ChipIN Centre |
FAQs
Q1. What is the Design Linked Incentive Scheme?
Ans: A MeitY scheme under Semicon India to boost domestic semiconductor design via financial incentives and EDA tool access.
Q2. Who is eligible for DLI Scheme?
Ans: Indian startups, MSMEs, and domestic companies involved in semiconductor design.
Q3. What incentives are offered?
Ans: Up to 50% design cost reimbursement (₹15 Cr cap) and 6–4% sales incentive for 5 years (₹30 Cr cap).
Q4. How to access EDA tools?
Ans: Through ChipIN Centre – a national EDA grid offering remote tool access.